TSL2585 datasheet(76/86 Pages) OSRAM

76 / 86 page

Datasheet, Public

Page 75

[v4-00] 2022-Dec-22

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TSL2585 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 98:

Solder Reflow Profile

Note(s):

1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

Profile Feature Preheat/Soak

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Temperature Min (Tsmin)

100°C

150°C

Temperature Max (Tsmax)

150°C

200°C

Time (ts) from (Tsmin to Tsmax)

60-120 seconds

Ramp-up rate (TL to TP)

3°C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

183°C

60-150 seconds

217°C

60-150 seconds

Peak package body temperature (TP)

For users TP must not exceed the

Classification temp of 235°C

For suppliers TP must equal or

exceed the Classification temp

of 235°C

For users TP must not exceed the

Classification temp of 260°C

For suppliers TP must equal or

exceed the Classification temp of

260°C

Time (tP)

(1) within 5°C of the

specified classification temperature

(Tc)

20 (1) seconds

30 (1) seconds

Ramp-down rate (TP to TL)

6°C/second max.

Time 25°C to peak temperature

6 minutes max.

8 minutes max.

Soldering & Storage

Information

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