TSL2568CS datasheet(49/56 Pages) OSRAM

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Page 48

ams Datasheet

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[v1-00] 2016-Apr-12

TSL2568, TSL2569 − Manufacturing Information

Tooling Required

• Chipscale

• Solder stencil (square aperture size 0.210mm,

stencil thickness of 152μm)

• TMB

• Solder stencil (aperture size 0.70mm x 0.90mm,

stencil thickness of 152μm)

Process

Apply solder paste using stencil

Place component

Reflow solder/cure

X-Ray verify (recommended for chipscale only)

Additional Notes for Chipscale

Placement of the TSL2568/TSL2569 chipscale device onto the

gold immersion substrate is accomplished using a standard

surface mount manufacturing process. Using a 152μm stencil

with a 0.21mm square aperture, print solder paste onto the

substrate. Machine-place the TSL2568/TSL2569 from the tape

onto the substrate. A suggest pick-up tool is the Siemens

Vacuum Pickup tool nozzle number 912. This nozzle has a

rubber tip with a diameter of approximately 0.75mm. The part

is picked up from the center of the body.

It is important to use a substrate that has an immersion plating

surface. This may be immersion gold, solder, or white tin. Hot

air solder leveled (HASL) substrates are not coplanar, making

them difficult to work with.

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package

molding compound. To ensure the package molding

compound contains the smallest amount of absorbed moisture

possible, each device is dry-baked prior to being packed for

shipping. Devices are packed in a sealed aluminized envelope

with silica gel to protect them from ambient moisture during

shipping, handling, and storage before use.

The CS package has been assigned a moisture sensitivity level

of MSL 2 and the devices should be stored under the following

conditions:

• Temperature Range: 5°C to 50°C

• Relative Humidity: 60% maximum

• Floor Life: 1 year out of bag at ambient < 30°C / 60% RH

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