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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TSL2568CS датащи(PDF) 44 Page - OSRAM GmbH |
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TSL2568CS датащи(HTML) 44 Page - OSRAM GmbH |
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44 / 56 page  ams Datasheet Page 43 [v1-00] 2016-Apr-12 Document Feedback TSL2568, TSL2569 − Packaging Mechanical Data Figure 41: Package CS - Six-Lead Chipscale Packaging Configuration Note(s): 1. All linear dimensions are in micrometers. Dimension tolerance is ±25μm unless otherwise noted. 2. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%). 3. The top of the photodiode active area is 410μm below the top surface of the package. 4. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53. 5. This drawing is subject to change without notice. Packaging Mechanical Data 171 1398 465 203 1250 6 y 100 400 + 50 700 + 55 TYP 30 5 500 500 375 + 30 500 375 + 30 1750 TOP VIEW SIDE VIEW BOTTOM VIEW END VIEW 6 y j 210 + 30 1 2 3 6 5 4 PIN OUT BOTTOM VIEW Green RoHS |
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