TMD2621 datasheet(50/59 Pages) OSRAM

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Datasheet, Public

Page 49

[v4-00] 2023-Apr-12

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TMD2621 − Soldering & Storage Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 68:

Solder Reflow Profile

Note(s):

1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

Profile Feature

Preheat/ Soak

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Temperature Min (Tsmin)

100 °C

150 °C

Temperature Max (Tsmax)

150 °C

200 °C

Time (ts) from (Tsmin to Tsmax)

60s - 120s

60s -120s

Ramp-up rate (TL to TP)

3 °C/s max.

Liquidous temperature (TL)

Time (tL) maintained above TL

183 °C

60s - 150s

217 °C

60s - 150s

Peak package body temperature (TP)

For users TP must not exceed the

classification temp. of 235 °C.

For suppliers TP must equal or

exceed the classification temp.

of 235 °C.

For users TP must not exceed the

classification temp. of 260 °C.

For suppliers TP must equal or

exceed the classification temp. of

260 °C.

Time (tP)

(1) within 5 °C of the specified

classification temperature (Tc)

20(1)s30(1)s

Ramp-down rate (TP to TL)

6 °C/s max.

Time 25 °C to peak temperature

6 minutes max.

8 minutes max.

Soldering & Storage

Information

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