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PCF8812U/2 датащи(PDF) 34 Page - NXP Semiconductors |
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PCF8812U/2 датащи(HTML) 34 Page - NXP Semiconductors |
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34 / 36 page ![]() 2000 Nov 22 34 Philips Semiconductors Product specification 65 × 102 pixels matrix LCD driver PCF8812 22 TRAY INFORMATION handbook, full pagewidth ,,,,,,, ,,,,,,, MGT651 D F E x y A G H 1,1 x,1 2,1 1,2 1,3 1,y x,y 2,2 3,1 C B K L M J A A SECTION A-A Fig.22 Tray details. Table 10 Tray dimensions handbook, halfpage MGT652 Fig.23 Tray alignment. The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram for the orientating and position of the type name on the die surface. DIMENSION DESCRIPTION VALUE A pocket pitch; x direction 13.77 mm B pocket pitch; y direction 4.37 mm C pocket width; x direction 11.04 mm D pocket width; y direction 2.24 mm E tray width; x direction 50.8 mm F tray width; y direction 50.8 mm G distance from cut corner to pocket (1 and 1) centre 11.68 mm H distance from cut corner to pocket (1 and 1) centre 5.74 mm J tray thickness 3.96 mm K tray cross section 1.78 mm L tray cross section 2.49 mm M pocket depth 0.89 mm x no. pockets in x direction 3 y no. pockets in y direction 10 |
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