2000 Nov 22

27

Philips Semiconductors

Product specification

65

× 102 pixels matrix LCD driver

PCF8812

The required minimum value for the external capacitors in an application with the PCF8812 are as follows:

Higher capacitor values are recommended for ripple reduction.

18 CHIP INFORMATION

19 PAD INFORMATION

Table 8

Bonding pad dimensions

NAME

DIMENSION

Pad pitch

70

µm

Pad size; aluminium

62

× 100 µm

Bump dimensions

50

× 90 × 17.5 µm(±5)

Wafer thickness; including bumps

maximum 430

µm

Wafer thickness; without bumps

381

µm typ.

handbook, full pagewidth

MGT649

DISPLAY 102

× 65

VDD

I/O

VSS VLCDIN

CVDD

reset

PCF8812

102

32

33

Fig.19 Application diagram; external high voltage generation is used.