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VSC8541-02 датащи(PDF) 97 Page - Microchip Technology

номер детали VSC8541-02
подробное описание детали  Single Port Gigabit Ethernet Copper PHY with GMII/RGMII/MII/RMII Interfaces
PDF  101 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

VSC8541-02 датащи(HTML) 97 Page - Microchip Technology

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Package Information
VMDS-10513 VSC8541-02 Datasheet Revision 4.1
88
PCB). For more information about the thermal measurement method used for this device, see the
JESD51-1 standard.
To achieve results similar to the modeled thermal measurements, the guidelines for board design
described in the JESD51 family of publications must be applied. For information about applications using
QFN packages, see the following:
•
JESD51-2A, Integrated Circuits Thermal Test Method Environmental Conditions, Natural Convection
(Still Air)
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions, Forced Convection
(Moving Air)
•
JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions, Junction-to-Board
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal
Attachment Mechanisms
7.3
Moisture Sensitivity
This device is rated moisture sensitivity level 3 or better as specified in the joint IPC and JEDEC standard
IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
Table 118 •
Thermal Resistances
Symbol
°C/W
Parameter
θJCtop
19.3
Die junction to package case top
θJB
6.6
Die junction to printed circuit board
θJA
26.6
Die junction to ambient
θJMA at 1 m/s
20.0
Die junction to moving air measured at an air speed of 1 m/s
θJMA at 2 m/s
19.0
Die junction to moving air measured at an air speed of 2 m/s



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