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VSC8541-02 датащи(PDF) 95 Page - Microchip Technology |
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VSC8541-02 датащи(HTML) 95 Page - Microchip Technology |
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95 / 101 page ![]() Package Information VMDS-10513 VSC8541-02 Datasheet Revision 4.1 86 7 Package Information The VSC8541XMV-02 package is a lead-free (Pb-free), 68-pin, plastic quad flat no-lead (QFN) package with an exposed pad, 8 mm × 8 mm body size, 0.4 mm pin pitch, and 0.9 mm maximum height. Lead-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the VSC8541-02 device. 7.1 Package Drawing The following illustration shows the package drawing for the VSC8541-02 device. The drawing contains the top view, bottom view, side view, dimensions, tolerances, and notes. |
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