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BSH101 датащи(PDF) 5 Page - NXP Semiconductors |
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BSH101 датащи(HTML) 5 Page - NXP Semiconductors |
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5 / 12 page ![]() 2000 Jul 19 5 Philips Semiconductors Product specification N-channel enhancement mode MOS transistor BSH101 CHARACTERISTICS Tj =25 °C unless otherwise speciÞed. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID =10 µA60 −− V VGSth gate-source threshold voltage VGS =VDS; ID = 1 mA 1 −− V IDSS drain-source leakage current VGS = 0; VDS =48V −− 100 nA IGSS gate leakage current VGS = ±20 V; VDS =0 −− ±100 nA RDSon drain-source on-state resistance VGS = 10 V; ID = 0.35 A −− 0.81 Ω VGS = 4.5 V; ID = 0.175 A −− 0.93 Ω Ciss input capacitance VGS = 0; VDS =48V; f=1MHz − 72.2 − pF Coss output capacitance VGS = 0; VDS =48V; f=1MHz − 11.3 − pF Crss reverse transfer capacitance VGS = 0; VDS =48V; f=1MHz − 3.6 − pF QG total gate charge VGS = 10 V; VDD =30V; ID = 0.35 A; Tamb =25 °C − 2130 − pC QGS gate-source charge VDD =30V; ID = 0.35 A; Tamb =25 °C − 150 − pC QGD gate-drain charge VDD =30V; ID = 0.35 A; Tamb =25 °C − 695 − pC Switching times td(on) turn-on delay time VGS = 0 to 10 V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 3.5 − ns tf fall time VGS = 0 to 10 V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 3.5 − ns ton turn-on switching time VGS = 0 to 10 V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 7 − ns td(off) turn-off delay time VGS =10to0V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 9 − ns tr rise time VGS =10to0V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 4.5 − ns toff turn-off switching time VGS =10to0V; VDD =30V; ID = 0.35 A; Rgen =6 Ω − 13.5 − ns Source-drain diode VSD source-drain diode forward voltage VGD = 0; IS = 0.5 A −− 1V trr reverse recovery time IS = 0.5 A; di/dt = −10 A/µs − 35 − ns |
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