поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

FXPS7115D4 датащи(PDF) 58 Page - NXP Semiconductors

номер детали FXPS7115D4
подробное описание детали  Digital absolute pressure sensor, 40 kPa to 115 kPa
PDF  72 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

FXPS7115D4 датащи(HTML) 58 Page - NXP Semiconductors

Back Button FXPS7115D4 Datasheet HTML 54Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 55Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 56Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 57Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 58Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 59Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 60Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 61Page - NXP Semiconductors FXPS7115D4 Datasheet HTML 62Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 58 / 72 page
background image
NXP Semiconductors
FXPS7115D4
Digital absolute pressure sensor, 40 kPa to 115 kPa
aaa-029734
temperature (°C)
130
85
25
-20
0
-40
0
-1.0
1.0
2.0
1.75
-1.75
absolute
pressure
error
(kPa)
-2.0
absolute pressure accuracy
= ± 1.25 kPa from 0°C - 85°C
Figure 23. Absolute pressure accuracy as a function of temperature
Figure 24. Absolute pressure accuracy multiplier over life
14 Application information
The FXPS7115D4 sensor can operate in two modes: I2C and SPI. The application diagrams in Figure 25 and
Figure 26 show the modes and their respective biasing and bypass components.
The sensor can be configured to operate in SPI mode to read the user registers, self-test and diagnostics
information. The application diagram in Figure 26 shows the SPI and the respective biasing and bypass
components.
Note: A gel is used to provide media protection against corrosive elements which may otherwise damage
metal bond wires and/or IC surfaces. Highly pressurized gas molecules may permeate through the gel and then
occupy boundaries between material surfaces within the sensor package. When decompression occurs, the gas
molecules may collect, form bubbles and possibly result in delamination of the gel from the material it protects.
If a bubble is located on the pressure transducer surface or on the bond wires, the sensor measurement may
shift from its calibrated transfer function. In some cases, these temporary shifts could be outside the tolerances
listed in the data sheet. In rare cases, the bubble may bend the bond wires and result in a permanent shift.
FXPS7115D4
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.V. All rights reserved.
Product data sheet
Rev. 6.2 — 28 June 2023
58 / 72



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com