PCAL9714 datasheet(56/56 Pages) NXP

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NXP Semiconductors

PCAL9714

Ultra low-voltage translating 14-bit SPI I/O expander with Agile I/O features, interrupt output, and

reset

Contents

General description ............................................ 1

Features and benefits .........................................3

2.1

Agile I/O features ...............................................3

2.2

Additional Agile I/O Plus features ...................... 3

Ordering information .......................................... 4

3.1

Ordering options ................................................ 4

Block diagram ..................................................... 5

Pinning information ............................................ 6

5.1

Pinning ...............................................................6

5.2

Pin description ................................................... 6

Functional description ........................................8

6.1

Device address ..................................................8

6.2

Interface definition ............................................. 8

6.3

Pointer register and command byte ...................8

6.4

6.4.1

Input port registers (00h, 01h) ......................... 10

6.4.2

Output port registers (02h, 03h) ...................... 11

6.4.3

Polarity inversion register pair (04h, 05h) ........ 11

6.4.4

Configuration registers (06h, 07h) ................... 12

6.4.5

Output drive strength registers (40h, 41h,

42h, 43h) ......................................................... 12

6.4.6

Input latch registers (44h, 45h) ........................13

6.4.7

Pullup/pulldown enable registers (46h, 47h) .... 14

6.4.8

Pullup/pulldown selection registers (48h,

49h) ..................................................................14

6.4.9

Interrupt mask registers (4Ah, 4Bh) .................14

6.4.10

Interrupt status registers (4Ch, 4Dh) ............... 15

6.4.11

Output port configuration register (4Fh) ...........15

6.4.12

Interrupt edge registers (50h, 51h, 52h,

53h) ..................................................................16

6.4.13

Interrupt clear registers (54h, 55h) .................. 16

6.4.14

Input port without interrupt clear registers

(56h, 57h) ........................................................ 17

6.4.15

Output port configuration register pair (bit-

wise) (58h, 59h) ...............................................17

6.4.16

Switch debounce enable registers (5Ah,

5Bh) ................................................................. 18

6.4.17

Switch debounce count register (5Ch) .............18

6.5

I/O port .............................................................18

6.6

Power-on reset ................................................ 19

6.7

Reset input (RESET) .......................................19

6.8

Interrupt output (INT) .......................................19

6.9

Switch debounce circuitry ................................20

6.10

Bus transactions .............................................. 22

6.10.1

SPI interface (addressable SPI) ...................... 22

6.10.1.1 SPI write access sequence ............................. 23

6.10.1.2 SPI read access sequence ..............................24

6.10.1.3 SPI and auto increment ...................................25

Application information ....................................26

7.1

Minimizing IDD when the I/Os are used to

control LEDs .................................................... 26

7.2

Output drive strength control ........................... 27

7.3

Power-on reset requirements .......................... 28

7.4

Device current consumption with internal

pullup and pulldown resistors .......................... 30

Limiting values ..................................................31

Recommended operating conditions .............. 32

Thermal characteristics ....................................33

Static characteristics ........................................34

11.1

Typical characteristics ......................................38

Dynamic characteristics ...................................41

Parameter measurement information ..............43

Package outline .................................................46

Soldering of SMD packages .............................47

15.1

Introduction to soldering .................................. 47

15.2

Wave and reflow soldering .............................. 47

15.3

Wave soldering ................................................47

15.4

Reflow soldering .............................................. 47

Soldering: PCB footprints ................................49

Abbreviations .................................................... 50

Revision history ................................................ 51

Legal information ..............................................52

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 1 May 2023

Document identifier: PCAL9714

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