CS5920 datasheet(17/160 Pages) AMCC

17 / 160 page

S5920 – PCI Product

Revision 1.01 – November 28, 2005

AMCC Confidential and Proprietary

DS1596

Data Book

AMCC’S RELIABILITY VIGIL

AMCC’s internal reliability vigil consists of three

phases:

•

New/changed processes and material qualifi-

cations

•

In-process Quality monitors

•

Periodic operating life and environmental test-

ing

New/Changed Wafer Processes and Material Quali-

fications

In order to initially release a device to production a

standard set of MIL-STD-883 tests must be completed

successfully. These tests include:

Wafer Process and Design

•

Operating Life Method 1005

•

ESD Characterization Method 3015

•

Wire Bond Pull Method 2011

•

Thermal Shock or Method 1011 or 1010 Tem-

perature Cycling

Package and Related Materials

•

Selected Subgroups of MIL-STD-883, Method

5005, Group B and D

AMCC adheres to MIL-I-38535 with regards to

changes.

If changes to production released devices are deter-

mined to be major, the appropriate qualification testing

must be successfully completed prior to change

approval.

In-Process Quality Monitors

•CV plots

•

Airborne particle count

•

Bacteria, particle count, and resistivity on DI

water

•

ESD work stations and procedures

•

In-line testing of process gases

•

Temperature and humidity control

•

SPC in wafer fabrication

•

SEM of all military lots

Periodic Operating Life and Environmental Testing

•

Performed on a product from each process

family quarterly.

•

1000 hour operating life test (minimum),

Method 5005, Group C.

•

Temperature cycling per Method 1010, 100

cycles, condition C: –65°C/150°C

•

Environmental testing per AMCC standard test

procedures. Consult factory for further details.

Final Measure and Assurance of Quality

The cost of defects depends on when the failure

occurs. For example, costs rise significantly as unde-

tected defective ICs are integrated into systems. High

quality parts cut costs substantially, and the extra qual-

ity built into every AMCC device means added value to

our customers.

To achieve maximum quality, AMCC employs 100%

testing of all devices, followed by stringent QA

sampling.

AMCC performs QA sampling measurements at full

specification temperature, both DC and AC, to achieve

the tightest AQLs in the industry.

RADIATION HARDNESS

High energy radiation can cause structural changes in

the silicon and silicon dioxide crystal lattice by displac-

ing atoms from their normal crystal sites. These

changes can be responsible for increased junction

leakage, degraded transistor current gain (b), and

increased parasitic Si/SiO2 interface leakage currents.

The damage is generally induced by neutrons, X-rays,

and gamma rays. The effects of the damage induced

by this radiation can change both AC and DC parame-

ters, affect functional performance, and, in severe

cases, destroy the device.

Certain of AMCC’s high performance products are

inherently radiation resistant. The radiation resistance

of AMCC IC’s is the result of the small geometries, the

structure of the fabrication process itself, and the use

of ECL logic within the device. Contact your AMCC

representative regarding radiation resistance charac-

teristics associated with a specific product.

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