ADIS16201SLASHPCB datasheet(30/32 Pages) AD

30 / 32 page

ADIS16201

Data Sheet

Rev. C | Page 30 of 32

BANDGAP REFERENCE

The ADIS16201 provides an on-chip band gap reference of

2.5 V, which is utilized by the on-board ADC and DAC. This

internal reference also appears on the VREF pin. This reference

can be connected to external circuits in the system. An external

buffer would be required because of the low drive capability of

the VREF output.

POWER-ON RESET OPERATION

An internal power-on reset (POR) is implemented internally to

the ADIS16201. For VDD below 2.35 V, the internal POR holds

the ADIS16201 in reset. As VDD rises above 2.35 V, an internal

timer times out for typically 130 ms before the part is released

from reset. The user must ensure that the power supply has

reached a stable 3.0 V minimum level by this time. Likewise,

on power-down, the internal POR holds the ADIS16201 in reset

until VDD has dropped below 2.35 V. Figure 40 illustrates the

operation of the internal POR in detail.

VDD

POR

130ms TYP

2.35V TYP

Figure 40. Internal Power-On Reset Operation

SECOND-LEVEL ASSEMBLY

The ADIS16201 can be attached to the second-level assembly

board using SN63 (or equivalent) or lead-free solder. Figure 41

and Table 32 provide acceptable solder reflow profiles for each

solder type. Note: These profiles may not be the optimum

profile for the user’s application. In no case should 260°C be

exceeded. It is recommended that the user develop a reflow

profile based upon the specific application. In general, keep in

mind that the lowest peak temperature and shortest dwell time

above the melt temperature of the solder result in less shock and

stress to the product. In addition, evaluating the cooling rate

and peak temperature can result in a more reliable assembly.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Figure 41. Acceptable Solder Reflow Profiles

Table 32.

Condition

Profile Feature

Sn63/Pb37

Pb-Free

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

100°C

150°C

Maximum Temperature (TSMAX)

150°C

200°C

Time (TSMIN to TSMAX) (ts)

60 sec to

120 sec

60 sec to

150 sec

TSMAX to TL

Ramp-Up Rate

3°C/sec

Time Maintained Above

Liquidous (TL)

Liquidous Temperature (TL)

183°C

217°C

Time (tL)

60 sec to

150 sec

60 sec to

150 sec

Peak Temperature (TP)

240°C +

0°C/–5°C

260°C +

0°C/–5°C

Time Within 5°C of Actual Peak

Temperature (tp)

10 sec to

30 sec

20 sec to

40 sec

Ramp-Down Rate

6°C/sec max

Time 25°C to Peak Temperature

6 min max

8 min max

EXAMPLE PAD LAYOUT

1.178 BSC

(8 PLCS)

0.500 BSC

(16 PLCS)

1.127 BSC

(16 PLCS)

0.670 BSC

(12 PLCS)

7.873 BSC

(2 PLCS)

Figure 42. Example Pad Layout

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