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RYZ024A датащи(PDF) 16 Page - Renesas Technology Corp

номер детали RYZ024A
подробное описание детали  LTE Category M1 Module
PDF  40 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RYZ024A датащи(HTML) 16 Page - Renesas Technology Corp

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RYZ024A
Datasheet
R19DS0115EU0101 Rev.1.01
Page 16 of 38
Nov.14.22
Figure 8. Setup for Current Peak Characterization
Peak Current Characterization
Table 24 represents the peak current values measured on the setup shown on Figure 8 for different voltages
and temperatures within the range supported by RYZ024A.
Table 24.
Peak Power Characterization
Input Voltage
Board at -40°C
Board at -30°C
Board at +25°C
Board at +85°C
5.5 V
328 mA
305 mA
263 mA
268 mA
3.8 V
475 mA
438 mA
444 mA
479 mA
2.5 V
705 mA
667 mA
679 mA
741 mA
2.2 V
676 mA
640 mA
652 mA
717 mA
Margin
Important:
It is recommended that designs that could be sensitive to the peak current described in this
section include the recommended Cext 2x22 µF and dimension the power supply with an
extra 20% margin with respect to the values provided in this section.
Electrical Maximum Ratings
Table 25.
Electrical Maximum Ratings
Parameter
Minimum
Maximum
Supply Voltage VBAT
-0.2 V
5.5 V
I/Os in Power Group PVDD_1V8
-0.2 V
4.125 V
I/Os in Power Group PMU_5V
-0.2 V
6.0 V
Thermal Considerations
Special attention needs to be given to thermal dissipation.
The outer layers of the host board must be covered in as many wide copper areas as possible, and those
must be stitched with evenly spaced ground vias. Care must be taken that no air gap exists along the
thermal path from the RYZ024A to the dissipating copper area(s). Gaps can be filled with heat conducting
materials such as GapPad™.
The Gxx pads should be tied to a large ground plane on the customer's PCB layer 1. It is also recommended
to have the Gxx pads area on the PCB stitched with through ground vias to improve thermal dissipation.
If the host board is piggybacked over a larger board, the aforementioned heat dissipation considerations
should be applied to both the main and the daughter board.



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