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RYZ024A датащи(PDF) 16 Page - Renesas Technology Corp |
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RYZ024A датащи(HTML) 16 Page - Renesas Technology Corp |
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16 / 40 page ![]() RYZ024A Datasheet R19DS0115EU0101 Rev.1.01 Page 16 of 38 Nov.14.22 Figure 8. Setup for Current Peak Characterization Peak Current Characterization Table 24 represents the peak current values measured on the setup shown on Figure 8 for different voltages and temperatures within the range supported by RYZ024A. Table 24. Peak Power Characterization Input Voltage Board at -40°C Board at -30°C Board at +25°C Board at +85°C 5.5 V 328 mA 305 mA 263 mA 268 mA 3.8 V 475 mA 438 mA 444 mA 479 mA 2.5 V 705 mA 667 mA 679 mA 741 mA 2.2 V 676 mA 640 mA 652 mA 717 mA Margin Important: It is recommended that designs that could be sensitive to the peak current described in this section include the recommended Cext 2x22 µF and dimension the power supply with an extra 20% margin with respect to the values provided in this section. Electrical Maximum Ratings Table 25. Electrical Maximum Ratings Parameter Minimum Maximum Supply Voltage VBAT -0.2 V 5.5 V I/Os in Power Group PVDD_1V8 -0.2 V 4.125 V I/Os in Power Group PMU_5V -0.2 V 6.0 V Thermal Considerations Special attention needs to be given to thermal dissipation. The outer layers of the host board must be covered in as many wide copper areas as possible, and those must be stitched with evenly spaced ground vias. Care must be taken that no air gap exists along the thermal path from the RYZ024A to the dissipating copper area(s). Gaps can be filled with heat conducting materials such as GapPad™. The Gxx pads should be tied to a large ground plane on the customer's PCB layer 1. It is also recommended to have the Gxx pads area on the PCB stitched with through ground vias to improve thermal dissipation. If the host board is piggybacked over a larger board, the aforementioned heat dissipation considerations should be applied to both the main and the daughter board. |
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