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RYZ024A датащи(PDF) 6 Page - Renesas Technology Corp

номер детали RYZ024A
подробное описание детали  LTE Category M1 Module
PDF  40 Pages
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производитель  RENESAS [Renesas Technology Corp]
домашняя страница  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RYZ024A датащи(HTML) 6 Page - Renesas Technology Corp

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RYZ024A
Datasheet
R19DS0115EU0101 Rev.1.01
Page 6 of 38
Nov.14.22
I2C
Note: See section Power for behavior of IOs in Deep Sleep mode.
Table 5.
I2C Pad Details
Pad #
Pad Name
Primary
Function
Alternate
Function1
Power
Group
Direction
Pad
Type2
State at
reset
95
GPIO23/ I2C_SDA
GPIO23
I2C_SDA
PVDD_1V8
In/Out
BIDIR
HighZ
97
GPIO24/ I2C_SCL
GPIO24
I2C_SCL
PVDD_1V8
In/Out
BIDIR
HighZ
1. Alternate functions will be available in future versions via SW upgrade.
2. I2C pad types electrical characteristics are detailed in Table 19.
PCM
Note: See section Power for behavior of IOs in Deep Sleep mode.
Table 6.
PCM Pad Details
Pad #
Pad Name
Primary
Function
Alternate
Function1
Power
Group
Direction
Pad
Type2
State at
reset
96
GPIO4/ PCM_CLK
GPIO4
PCM_CLK
PVDD_1V8
In/Out
BIDIR
HighZ
98
GPIO3/ PCM_RXD
GPIO3
PCM_RXD
PVDD_1V8
In/Out
BIDIR
HighZ
99
GPIO5/ PCM_FS
GPIO5
PCM_FS
PVDD_1V8
In/Out
BIDIR
HighZ
100
GPIO6/ PCM_TXD
GPIO6
PCM_TXD
PVDD_1V8
In/Out
BIDIR
HighZ
1.
Alternate functions will be available in future versions via SW upgrade.
2.
PCM pad type’s electrical characteristics are detailed in Table 19.
SPI
Note: See section Power for behavior of IOs in Deep Sleep mode.
Table 7.
SPI Pad Details
Pad #
Pad Name
Primary
Function
Alternate
Function1
Power
Group
Direction
Pad
Type2
State at
reset
3
GPIO7/
SPI_SDI
GPIO7
SPI_SDI
PVDD_1V8
In/Out
BIDIR
HighZ
4
GPIO8/
SPI_SDO
GPIO8
SPI_SDO
PVDD_1V8
In/Out
BIDIR
HighZ
2
GPIO9/
SPI_CLK
GPIO9
SPI_CLK
PVDD_1V8
In/Out
BIDIR
HighZ
5
GPIO10/
SPI_CSN1
GPIO10
SPI_CSN1
PVDD_1V8
In/Out
BIDIR
HighZ
7
GPIO11/
SPI_CSN2
GPIO11
SPI_CSN2
PVDD_1V8
In/Out
BIDIR
HighZ
1. Alternate functions will be available in future versions via SW upgrade.
2. SPI pad types electrical characteristics are detailed in Table 19.



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