ST33TPHF2XSPI datasheet(31/35 Pages) STMICROELECTRONICS

31 / 35 page

Contents

Description ........................................................................3

1.1

Security certifications ........................................................... 3

Pin and signal description .........................................................4

Serial peripheral interface (SPI) and TPM registers .................................5

3.1

SPI communication protocol flow control ........................................... 5

3.1.1

SPI communication ....................................................... 5

3.1.2

Protocol flow control for SPI read access ...................................... 6

3.1.3

Protocol flow control for SPI write access ...................................... 7

3.2

3.2.1

FIFO interface ........................................................... 8

3.2.2

Command response buffer interface .......................................... 9

3.3

3.4

Additional information .......................................................... 10

3.5

Recommendations ............................................................ 10

3.6

Integration requirements ....................................................... 10

Electrical characteristics..........................................................11

4.1

Absolute maximum ratings...................................................... 11

4.2

DC and AC characteristics ...................................................... 11

4.3

Overshoot.................................................................... 12

4.4

Performance and power consumption characteristics ............................... 12

4.5

SPI characteristics ............................................................ 14

4.6

AC measurement conditions .................................................... 15

Integration guidance..............................................................17

5.1

Typical hardware implementation ................................................ 17

5.2

Power supply filtering .......................................................... 18

Package information..............................................................19

6.1

VFQFPN32 package information ................................................ 19

6.2

Thermal characteristics of packages ............................................. 21

Delivery packing..................................................................22

Package marking information .....................................................24

Ordering information .............................................................25

Support and information ..........................................................26

Appendix A Terms and abbreviations .................................................27

Appendix B Referenced documents ..................................................29

ST33TPHF2XSPI

Contents

DS14186 - Rev 1

page 31/35

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