 2019 Microchip Technology Inc.

DS20006185A-page 22

ATF1504ASV/ATF1504ASVL

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

SECTION A-A

H

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E1

A2

e

L

E

N

0.80 BSC

1.00

0.45

0.30

-

0.05

-

0.60

-

-

MILLIMETERS

MIN

NOM

44

0.75

0.45

1.20

0.15

MAX

L1

1.00 REF

-

Footprint

Overall Length

Molded Package Length

D

D1

12.00 BSC

10.00 BSC

Terminal Thickness

c

0.09

-

0.20

R1

R2

1

-

0.08

-

Lead Bend Radius

-

0.08

0.20

Lead Bend Radius

3.5°

0°

7°

Foot Angle

-

0°

-

Lead Angle

2

12°

11°

13°

Terminal-to-Exposed-Pad

12.00 BSC

10.00 BSC

0.95

1.05

(L1)

L

2

2

1

c

Microchip Technology Drawing C04-21019-3EB Rev A Sheet 2 of 2

44-Lead Plastic Thin Quad Flatpack (3EB) - 10x10x1.0 mm Body [TQFP]

Atmel Legacy Global Package Code AIX