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STM32H753II датащи(PDF) 114 Page - STMicroelectronics |
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STM32H753II датащи(HTML) 114 Page - STMicroelectronics |
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114 / 361 page ![]() Electrical characteristics (rev Y) STM32H753xI 114/360 DS12117 Rev 8 I/O system current consumption The current consumption of the I/O system has two components: static and dynamic. I/O static current consumption All the I/Os used as inputs with pull-up generate a current consumption when the pin is externally held low. The value of this current consumption can be simply computed by using the pull-up/pull-down resistors values given in Table 59: I/O static characteristics. For the output pins, any external pull-down or external load must also be considered to estimate the current consumption. An additional I/O current consumption is due to I/Os configured as inputs if an intermediate voltage level is externally applied. This current consumption is caused by the input Schmitt trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog inputs. Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently, as a result of external electromagnetic noise. To avoid a current consumption related to floating pins, they must either be configured in analog mode, or forced internally to a definite digital value. This can be done either by using pull-up/down resistors or by configuring the pins in output mode. I/O dynamic current consumption In addition to the internal peripheral current consumption (see Table 38: Peripheral current consumption in Run mode), the I/Os used by an application also contribute to the current consumption. When an I/O pin switches, it uses the current from the MCU supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load (internal or external) connected to the pin: ISW VDDx fSW CL × × = where ISW is the current sunk by a switching I/O to charge/discharge the capacitive load VDDx is the MCU supply voltage fSW is the I/O switching frequency CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT Table 37. Typical and maximum current consumption in VBAT mode Symbol Parameter Conditions Typ(1) Max (3 V) Unit Backup SRAM RTC & LSE 1.2 V 2 V 3 V 3.4 V TJ = 25°C TJ = 85°C TJ = 105°C TJ = 125°C IDD (VBAT) Supply current in standby mode OFF OFF 0.024 0.035 0.062 0.096 0.5(1) 4.1(1) 10(1) 24(1) µA ON OFF 1.4 1.6 1.8 1.8 4.4(1) 22(1) 48(1) 87(1) OFF ON 0.24 0.45 0.62 0.73 - - - - ON ON 1.97 2.37 2.57 2.77 - - - - 1. Guaranteed by characterization results. |
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