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PM8805 датащи(PDF) 43 Page - STMicroelectronics

номер детали PM8805
подробное описание детали  IEEE 802.3bt PoE-PD interface with embedded dual active bridge
PDF  48 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

PM8805 датащи(HTML) 43 Page - STMicroelectronics

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PM8805
VFQFPN43 package mechanical data
48
7
VFQFPN43 package mechanical data
7.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
The VFQFPN43L is a custom version of the standard VFQFPN56L 8x8 package, where the
large exposed pad is replaced with 6 exp pads: 4 pads at each corner of the body are
electrically connected to the 4-pair inputs:
EP4 is internally connected with IN12 signal (drain of low-side MOSFET related to pair 1-2
of 1st bridge)
EP3 is internally connected with IN36 signal (drain of low-side MOSFET related to pair 3-6
of 1st bridge)
EP2 is internally connected with IN45 signal (drain of low-side MOSFET related to pair 4-5
of 2nd bridge)
EP1 is internally connected with IN78 signal (drain of low-side MOSFET related to pair 7-8
of 2nd bridge)
while a large, central exp pad is connected to VOB as well as the last exp pad, relevant to
the hot swap circuit:
EP5 is internally connected with VOB signal (drain of 4 high-side MOSFETs of both bridges,
common positive output voltage)
EP6 is internally connected with VOB signal (drain of the hot swap MOSFET)
The VFQFPN43L package is designed in order to guarantee the creepage distance
between signals at different voltage.



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