LT8350

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

SW1........................................................... –0.3V to 42V

SW2........................................................... –0.3V to 20V

BST1 .........................................................................47V

BST2.........................................................................25V

CTRL, FB, LOADEN, SYNC/MODE, PGOOD .. –0.3V to 5V

ISP–ISN ...........................................................–1V to 1V

CLKOUT, LOADTG .............................................. (Note 2)

Operating Junction Temperature Range (Notes 3, 4)

LT8350R............................................ –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

(Note 1)

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE**

MSL

RATING

TEMPERATURE RANGE

DEVICE

FINISH CODE

LT8350RV#PBF

Au (RoHS)

8350

e4

LQFN (Laminate

Package with

QFN Footprint)

3

–40°C to 150°C

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

**The LT8350 package has the same footprint as a standard 4mm × 6mm

QFN package.

32

31

30

TOP VIEW

LQFN PACKAGE

32-LEAD (6mm × 4mm × 0.94mm)

EXPOSED PAD (PINS 33, 34, 35, 36) ARE GND, MUST BE SOLDERED TO PCB

2

EN/UVLO

RP

LOADEN

SS

RT

SYNC/MODE

CLKOUT

LOADTG

ISMON

3

25

24

5

33

GND

34

GND

35

GND

36

GND

29

28

27

8

9

10

11

12

13

14

15

16

6

7

22

19

18

17

21

20