DDA002C

http://onsemi.com

27

PACKAGE DIMENSIONS

SOIC20 WB LESS PIN 17 (SO−19)

CASE 752AA−01

ISSUE O

19

1

11

10

b

19X

A3

A1

A

SEATING

PLANE

q

E

D

M

0.25

S

A

S

B

C

e

C

B

A

DIM

MIN

MAX

MILLIMETERS

A

2.35

2.65

A1

0.10

0.25

b

0.35

0.49

A3

0.23

0.32

D

12.65

12.95

E

7.40

7.60

e

1.27 BSC

H

10.05

10.55

h

0.25

0.75

L

0.50

0.90

q

0

7

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

__

DETAIL A

DETAIL A

SCALE 2X

11.00

19X

0.52

19X

1.30

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

19

10

11

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

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DDA002C/D

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