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SCY99080CDWR2G датащи(PDF) 7 Page - ON Semiconductor |
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SCY99080CDWR2G датащи(HTML) 7 Page - ON Semiconductor |
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7 / 27 page ![]() DDA002C http://onsemi.com 7 Electrical Characteristics (For typical values Tj = 25°C, for min/max values Tj = −40°C to +125°C, Vcc = 15 V unless otherwise noted) Symbol Unit Max Typ Min Pin Rating LOW IMPEDANCE DRIVE OUTPUTS (HGD, LGD) Tr – Hgd Output voltage rise−time @ CL = 1 nF, 10−90% of output signal 18, 17 − 80 − ns Tf – Hgd Output voltage fall−time @ CL = 1 nF, 10−90% of output signal 18, 17 − 40 − ns ROH – Hgd Source resistance – (Note 9) 18, 17 − 30 − Ω ROL − Hgd Sink resistance – (Note 9) 18, 17 − 15 25 Ω Tr – Lgd Output voltage rise−time @ CL 1 nF, 10−90% of output signal 15, 14 − 80 − ns Tf – Lgd Output voltage fall−time @ CL = 1 nF, 10−90% of output signal 15, 14 − 40 − ns ROH – Lgd Source resistance (Note 9) 15, 14 − 30 − Ω ROL − Lgd Sink resistance (Note 9) 15, 14 − 15 25 Ω T_dead−min Minimum dead−time, RDT = 2.7 kΩ from pin 9 to GND (Notes 20 and 21) 9 − 100 − ns T_dead−nom Nominal dead−time with RDT = 10 kΩ from pin 9 to GND (Notes 20 and 21) 9 245 300 355 ns T_dead−max Maximum dead−time with RDT = 82 kΩ from pin 9 to GND (Notes 20 and 21) 9 − 2 − ms IHV_LEAK Leakage current on high voltage pins to GND (Note 10) 17, 18, 19 − − 5 mA SYNCHRONIZATION DRIVE OUTPUTS (LGS AND HGS) ROH – S Source resistance 12, 13, 14 − 60 − Ω ROL – S Sink resistance 12, 13, 14 − 60 − Ω DGS (SYNCHRONOUS OUTPUT CLAMP) Tdgs Clamped on−time duration, Rdgs = 48 kΩ, Fsw < 24 kHz, DT = 300 ns (Notes 11, 20 and 21) 3, 12, 13 17.1 17.9 18.7 ms Iduty_min Minimum on−time duration, Rdgs = 12 kΩ, Fsw = Fmin (Notes 11, 20 and 21) 3, 12, 13 4.45 4.66 4.87 ms Iduty_nom Minimum on−time duration, Rdgs = 26 kΩ, Fsw < 24 kHz (Notes 11, 20 and 21) 3, 12, 13 9.65 10 10.35 ms TIMERS CIG_I CIG timer charging current 2 − 10 − mA CIG_E CIG timer ending voltage (Note 12) 2 − 5 − V CIG_t Typical CIG duration for a 0.22 mF capacitor on CIG pin 2 − 110 − ms SS_E Soft−start ending voltage (Note 13) 4 − 1.9 − V 4. VCC(min) = VCCreset 5. Outputs Lgs and Hgs (pin 9/10) are unloaded. 6. Guaranteed by design. 7. DCsh = (DChs/(DChs + DCls)) * 100%, DCsl = (DCls/(DChs + DCls)) * 100% 8. The VFB_DC_0 is the FB voltage below which are all outputs disabled. The FB voltage has to increases to VFB_DC_0 + VFB_DC_0_Hyste to re−enable all outputs of the controller. 9. Low impedance source and sink RDS(on) are designed to respectively deliver 0.5 A and −1 A at Tj = 100°C. 10.Pins 17, 18 and 19 are on the same potencial during IHV_LEAK measurements 11. On−time on synchro outputs wont be longer than on−time on power outputs. 12.The soft start pin is pulled down by an internal switch until the CIG timer ending voltage is reached 13.FB timer is disabled until the soft−start ending voltage is reached 14.EN1 input is blanked until the preheat period (CIG) ends. The OTP input is blanked during full startup sequence made of: PFC_del + CIG_t + SS_t 15.The FB timeout circuit starts to operate at the end of PFC_del + CIG_t + SS_t period. 16.An NTC resistor of 8.8 kW @ TA = 110°C is connected to ground. 17.The EN1 and EN2 input voltages have to go 50 mV below VEN1, VEN2 to release these inputs. 18.The OTP input voltage has to go 50 mV above OTPref_V to release this input. 19.The R_Fmin pin do not accept any bypass capacitor 20.Maximum acceptable capacitance connected to the pin is 100 pF 21.Measured for VCC = 10.5 V |
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