FUSB3317

www.onsemi.com

5

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

VBAT Battery Pin Voltage (Note 1)

−0.3 to 54

V

Connector Pins Voltage: VBUS, DISC, CATH, CC1, CC2, D+ and D−

−0.3 to 27 V

V

Low Voltage Pins: DC_EN, DON, IS−, VFB, IFG, BATUV, NTC, PDIV1 and

PDIV0

−0.3 to 6 V

V

Supply Output Range on Pin VDD

−0.3 to 6 V

V

Current Sense Input on Pin IS+

IS− + 0.1

V

Maximum Junction Temperature

150

°C

Storage Temperature Range

−65 to 150

°C

ESD Capability, Human Body Model (Note 2)

2

kV

ESD Capability, Charged Device Model (Note 2)

750

V

Lead Temperature Soldering

Reflow (SMD Styles Only), Pb−Free Versions (Note 3)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)

3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Resistance, Junction−to−Air (Note 4)

Thermal Reference, Junction−to−Case (Note 4)

36.1

2.3

°C/W

RECOMMENDED OPERATING RANGES

Rating

Symbol

Min

Max

Unit

Input VBAT Voltage

4.5

45

V

I/O VBUS Voltage

3.13

22.05

V

Output VDD Supply Voltage

4.75

5.5

V

I/O CC1 and CC2 Voltage

0

5.5

V

I/O D+ and D− Voltage

0

3.6

V

I/O PDIV0 and PDIV1 Voltage

0

5.5

V

I/O NTC Voltage

0

5.5

V

Output DON and DC_EN Voltage

0

5.5

V

Output Current as sensed by IS+ to IS− with 5 mΩ resistor

0

5

A

Ambient Temperature

−40

85 (Commercial)

105 (Automotive)

°C

Junction Temperature

−40

135

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.