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2019-2022 Microchip Technology Inc. and its subsidiaries

DS20006264C-page 17

MIC5396/7/8/9

8-Lead Extremely Thin DFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.08

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

NOTE 1

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

0.10 C

0.05 C

Microchip Technology Drawing C04-01260 Rev B Sheet 1 of 2

2X

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

D

A

A1

(A3)

2X CH

D2

E2

e

8X b

L

(L1)

12

N

12

N

8-Lead Extremely Thin Plastic Dual Flat, No Lead Package (K7A) - 1.6x1.2 mm Body

[X2DFN]; Micrel Legacy XTDFN1216-08L