MIC5396/7/8/9

DS20006264C-page 14

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2019-2022 Microchip Technology Inc. and its subsidiaries

8-Lead Ultra Thin DFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.07

C A B

0.05

C

C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

12

N

0.05

C A B

0.05

C A B

0.10 C

0.08 C

2X

8X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

8-Lead Ultra Thin Dual Flat, No Lead Package (HJA) - 1.6 x 1.2 x 0.6 mm Body [UDFN]

Micrel Legacy Package TMLF1216D-08L

Sheet 1 of 2

Microchip Technology Drawing C04-1153 Rev A

NOTE 1

SEATING

PLANE

(DATUM A)

(DATUM B)

NOTE 1

D

E

D2

E2

(CH)

e

8X b

L

12

N

K

A1

(A3)

A

A1