MIC5396 datasheet(4/26 Pages) MICROCHIP

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MIC5396/7/8/9

DS20006264C-page 4



2019-2022 Microchip Technology Inc. and its subsidiaries

Shutdown Current

ISHDN

—

0.05

µA

VEN1 = VEN2 = 0V

Ripple Rejection

PSRR

—

f = 1 kHz; COUT = 1 µF

Current Limit

ILIM

400

630

900

VOUT = 0V

Output Voltage Noise

—

µVRMS COUT = 1µF, 10 Hz to 100 kHz

Auto-Discharge NFET Resistance

RDS(ON)

—

MIC5397, MIC5399 Only;

VEN1 = VEN2 = 0V; VIN = 3.6V;

IOUT = –3 mA

Enable Inputs (EN1/EN2)

Enable Pull-Down Resistor

RPULL-DN

—

MΩ

MIC5398, MIC5399

Enable Input Voltage

VEN-LOW

—

0.2

Logic Low

VEN-HIGH 1.2

—

Logic High

Enable Input Current

MIC5396, MIC5397

IEN

—

0.01

µA

VEN = 0V

—

0.01

VEN = 5.5V

Enable Input Current

MIC5398, MIC5399

IEN

—

0.01

µA

VEN = 0V

—

1.4

VEN = 5.5V

Turn-On Time

tON

—

125

µs

COUT = 1 µF

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VIN1 = VEN1 = VOUT1 + 1V, VIN2 = VEN2 = VOUT2 + 1V, IOUT1 = IOUT2 = 100 µA; CIN1 =

CIN2 = COUT1 = COUT2 = 1 µF; TA = +25°C. Bold values are valid for –40°C to +125°C, unless noted. (Note 1).

Parameters

Symbol Min.

Typ.

Max.

Units Conditions

Note 1: Specification for packaged product only.

TEMPERATURE SPECIFICATIONS

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

Note 1

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

260

°C

Soldering, 10 sec.

Package Thermal Resistances

Thermal Resistance, UDFN-8

JA

—

172.6

—

°C/W —

Thermal Resistance, Extra Thin DFN-8

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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