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2019-2022 Microchip Technology Inc. and its subsidiaries

DS20006264C-page 15

MIC5396/7/8/9

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.40 BSC

0.152 REF

0.25

0.20

0.13

0.50

0.00

0.18

0.25

0.30

0.55

0.02

1.20 BSC

MILLIMETERS

MIN

NOM

8

0.35

0.30

0.23

0.60

0.05

MAX

K–

0.20

–

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

1.25

1.60 BSC

1.30

1.35

8-Lead Ultra Thin Dual Flat, No Lead Package (HJA) - 1.6 x 1.2 x 0.6 mm Body [UDFN]

Micrel Legacy Package TMLF1216D-08L

Microchip Technology Drawing C04-1153 Rev A

Exposed Pad Index Chamfer

CH

0.15 REF