PCF8545ATT datasheet(55/68 Pages) NXP

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NXP Semiconductors

PCF8545

Universal LCD driver for multiplex rates up to 1:8

• Reflow temperature profile; this profile includes preheat, reflow (in which the board

is heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder

paste characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 37 and Table 38

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

Table 37. SnPb eutectic process (from J-STD-020D)

Package reflow temperature (°C)

Volume (mm³)

Package thickness (mm)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

Table 38. Lead-free process (from J-STD-020D)

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 47.

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

MSL: Moisture Sensitivity Level

Figure 47. Temperature profiles for large and small components

PCF8545

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2 — 4 October 2021

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