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STM32L031C6 датащи(PDF) 101 Page - STMicroelectronics |
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STM32L031C6 датащи(HTML) 101 Page - STMicroelectronics |
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101 / 126 page ![]() DS10668 Rev 6 101/126 STM32L031x4/6 Package information 120 7.2 UFQFPN48 package information Figure 37. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads must also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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