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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8L052C6 датащи(PDF) 93 Page - STMicroelectronics |
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STM8L052C6 датащи(HTML) 93 Page - STMicroelectronics |
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93 / 103 page  DocID023331 Rev 2 93/103 STM8L052C6 Electrical parameters 97 Figure 35. Maximum dynamic current consumption on VREF+ supply pin during ADC conversion General PCB design guidelines Power supply decoupling should be performed as shown in Figure 36 or Figure 37, depending on whether VREF+ is connected to VDDA or not. Good quality ceramic 10 nF capacitors should be used. They should be placed as close as possible to the chip. ADC clock Sampling (n cycles) Conversion (12 cycles) Iref+ 300µA 700µA Table 48. RAIN max for fADC = 16 MHz (1) Ts (cycles) Ts (µs) RAIN max (kohm) Slow channels Fast channels 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V 4 0.25 Not allowed Not allowed 0.7 Not allowed 9 0.5625 0.8 Not allowed 2.0 1.0 16 1 2.0 0.8 4.0 3.0 24 1.5 3.0 1.8 6.0 4.5 48 3 6.8 4.0 15.0 10.0 96 6 15.0 10.0 30.0 20.0 192 12 32.0 25.0 50.0 40.0 384 24 50.0 50.0 50.0 50.0 1. Guaranteed by design, not tested in production. |
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