4.2

Thermal Specifications

The following table list the thermal specifications of the PD69200.

Table 4-2. Thermal Specifications

Thermal Resistance

Typ

Units

Notes

33

°C/W

Junction-to-ambient thermal resistance

1.8

°C/W

Junction-to-case thermal resistance

4.3

Recommended Solder Reflow Information

Following list shows the recommended solder reflow information details.

• RoHS 6/6

• Pb-free 100%

• Matte Tin Finish

• Package Peak Temperature for Solder Reflow (40 s maximum exposure)—260 °C (0 °C, –5 °C)

Table 4-3. Classification Reflow Profiles

Profile Feature

Sn-PbEutectic Assembly

Pb-Free Assembly

3 °C/second max

3 °C/second max

Preheat

100 °C

150 °C

150 °C

200 °C

60 s to 120 s

60 s to 180 s

Time Maintained

183 °C

217 °C

60 s to 150 s

60 s to 150 s

Peak Classification Temperature (TP)

210 °C to 235 °C

240 °C to 255 °C

Time within 5 °C of Actual Peak Temperature (tp)

10 s to 30 s

20 s to 40 s

Ramp-down Rate

6 °C/second max

6 °C/second max

Time 25 °C to Peak Temperature

6 minutes max

8 minutes max

PD69200

Package Information

Datasheet

DS00003460A-page 14