LT4200

17

Rev. 0

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PACKAGE DESCRIPTION

5.00 ±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

2

1

35

36

BOTTOM VIEW—EXPOSED PAD

6.95 ±0.10

8.00 ±0.10

0.75 ± 0.05

0.75 ±0.05

R = 0.125

TYP

0.00 – 0.05

0.22 ±0.05

(UHG36) QFN 0121 REV A

0.50 BSC

0.115 REF

0.200 REF

0.25 REF

7.0 REF

4.22 REF

0.28 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

2.50 REF

0.28 REF

0.40 ±0.10

0.00 – 0.05

0.70 ±0.05

0.5 ±0.05

0.50 BSC

1.00 BSC

7.00 REF

2.50 REF

4.10 ±0.05

5.50 ±0.05

0.22 ±0.05

6.95 ±0.05

3.60 ±0.05

8.25 ±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35 × 45° CHAMFER

UHG Package

36-Lead Plastic QFN (5mm × 8mm)

(Reference LTC DWG # 05-08-1790 Rev A)

3.60 ±0.10