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TC80310 датащи(PDF) 29 Page - NXP Semiconductors

номер детали TC80310
подробное описание детали  Alternator regulator with LIN
PDF  31 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

TC80310 датащи(HTML) 29 Page - NXP Semiconductors

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NXP Semiconductors
29
80310
6.2
Die characteristics
The die is designed to be fitted into a customer designed package, however as so many wiring configurations exist not all may be possible
from the same die design. Due to thermal considerations, soldering is the preferred die attach method, but under some circumstances,
conductive epoxy may be acceptable.
6.3
OTP default configuration (without any programming)
Default Regulation Voltage: 13.5 V
Phase Start Regulation: 800 RPM
Phase Stop Regulation: 500 RPM
LRC disable: 2400 RPM
LRC Rate: No LRC
Alternator Pole-pairs: 6
Slave Address: MID 29/11/12
Self start: ON
Self start threshold: 3000 RPM
BUS Time-out: 3 s
LIN Readout: Current
Thermal Compensation Threshold: 160 °C
10.6 V Reg: OFF.
The 10.6 V command is a real 10.6 V regulation when phase is ON (if Programmed, this command becomes a
regulation OFF command; lower regulation command is 10.7 V)
EL Fault HP mask: ON
The fault detection when the high phase signal is cut, is reported on the electrical fault (if programmed, this part of the
electrical fault is masked)
Low voltage threshold: none
One pole Filter: No, default is 2 pole filter
Crest regulation: OFF
LIN Com with Global ID (MID 2B + 3C): OFF
6.4
Crest regulation
Crest regulation bit OFF: The product is in load dump mode. EXC is stopped when the internal filter reaches Load dump detection
threshold (21 V typ.). The delay is given by the internal filter (~1.0 ms). Crest regulation bit is ON: The product is in crest regulation mode.
EXC is stopped immediately when internal ADC reaches 21 V. The delay is given by the ADC (~16 µs). For these two modes, Load Dump
or Crest regulation, EXC is always OFF if the condition on B+A is present.
Table 16. Physical die characteristics
Mechanical data
Length
Width
Units
Main Bonding Pad Size (200
μm wire)
0.66
0.5
mm
Die Size (Length x Width)
6.08
5.05
mm
Die Thickness
0.36
N/A
mm
Die Back Metal Composition
Ti/Ni/V/Ag
N/A
N/A
Die Back Metal Thickness, Typical
1.45
N/A
μm
Die Top Metal Thickness, Typical
2.0
N/A
μm
Die Top Metal Composition
99.5 Al
0.5 Cu
%



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