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TC80310 датащи(PDF) 29 Page - NXP Semiconductors |
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TC80310 датащи(HTML) 29 Page - NXP Semiconductors |
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29 / 31 page ![]() NXP Semiconductors 29 80310 6.2 Die characteristics The die is designed to be fitted into a customer designed package, however as so many wiring configurations exist not all may be possible from the same die design. Due to thermal considerations, soldering is the preferred die attach method, but under some circumstances, conductive epoxy may be acceptable. 6.3 OTP default configuration (without any programming) Default Regulation Voltage: 13.5 V Phase Start Regulation: 800 RPM Phase Stop Regulation: 500 RPM LRC disable: 2400 RPM LRC Rate: No LRC Alternator Pole-pairs: 6 Slave Address: MID 29/11/12 Self start: ON Self start threshold: 3000 RPM BUS Time-out: 3 s LIN Readout: Current Thermal Compensation Threshold: 160 °C 10.6 V Reg: OFF. The 10.6 V command is a real 10.6 V regulation when phase is ON (if Programmed, this command becomes a regulation OFF command; lower regulation command is 10.7 V) EL Fault HP mask: ON The fault detection when the high phase signal is cut, is reported on the electrical fault (if programmed, this part of the electrical fault is masked) Low voltage threshold: none One pole Filter: No, default is 2 pole filter Crest regulation: OFF LIN Com with Global ID (MID 2B + 3C): OFF 6.4 Crest regulation Crest regulation bit OFF: The product is in load dump mode. EXC is stopped when the internal filter reaches Load dump detection threshold (21 V typ.). The delay is given by the internal filter (~1.0 ms). Crest regulation bit is ON: The product is in crest regulation mode. EXC is stopped immediately when internal ADC reaches 21 V. The delay is given by the ADC (~16 µs). For these two modes, Load Dump or Crest regulation, EXC is always OFF if the condition on B+A is present. Table 16. Physical die characteristics Mechanical data Length Width Units Main Bonding Pad Size (200 μm wire) 0.66 0.5 mm Die Size (Length x Width) 6.08 5.05 mm Die Thickness 0.36 N/A mm Die Back Metal Composition Ti/Ni/V/Ag N/A N/A Die Back Metal Thickness, Typical 1.45 N/A μm Die Top Metal Thickness, Typical 2.0 N/A μm Die Top Metal Composition 99.5 Al 0.5 Cu % |
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