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DS00002774G-page 27

USB4712

9.3

Package Thermal Specifications

9.4

Power Consumption

This section details the power consumption of the device as measured during various modes of operation. Power dis-

sipation is determined by temperature, supply voltage, and external source/sink requirements.

Note:

The rise time for the 3.3V supply can be extended to 100ms max if RESET_N is actively driven low, typi-

cally by another IC, until 1 μs after all supplies are within operating range.

TABLE 9-1:

PACKAGE THERMAL PARAMETERS

Symbol

°C/W

Velocity (Meters/s)

35

0

31

1

19

0

0.3

0

2.4

0

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.

TABLE 9-2:

DEVICE POWER CONSUMPTION

Description

Typical Current

(mA)

Maximum

Current (mA)

Reset Current (mA)

0.40

3.60

Suspend Current (mA)

0.40

3.60

Idle

56

67

Active Operation (1 Full-Speed Device)

57

58

Active Operation (1 Hi-Speed Device)

73

74