6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per AEC Q100-002, all pins(1) HBM

ESD Classification Level 2

±2000

V

Charged device model (CDM), per AEC Q100-011, all pins CDM

ESD Classification Level C6

±1000

(1)

AEC Q100-002 indicated that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range

–0.3

85

V

Operating supply range

2.7

5.5

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA229-Q1

UNIT

DGS

10 PINS

Junction-to-ambient thermal resistance

177.6

°C/W

Junction-to-case (top) thermal resistance

66.4

°C/W

Junction-to-board thermal resistance

99.5

°C/W

Junction-to-top characterization parameter

9.7

°C/W

Junction-to-board characterization parameter

97.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA229-Q1

SLYS024A – MAY 2020 – REVISED JUNE 2021

www.ti.com

4

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: INA229-Q1