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ADL5580BCCZ-R7 датащи(PDF) 17 Page - Analog Devices |
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ADL5580BCCZ-R7 датащи(HTML) 17 Page - Analog Devices |
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17 / 22 page ![]() Data Sheet ADL5580 Rev. 0 | Page 17 of 22 INPUT AND OUTPUT INTERFACING Differential Input to Differential Output The ADL5580 can be configured as a differential input to differential output driver (see Figure 33). The 50 Ω resistors, R1 and R2, combined with the 100 Ω input impedance provide a 50 Ω input match with the 1:1 balun. The input and output 0.1 µF capacitors isolate the common-mode bias voltage (VBIAS) on input and output pins from the source and balanced load. The load is 50 Ω to provide the expected ac performance. + 5V 0.1µF 0.1µF 1:1BALUN AC 50Ω R1 50Ω R2 50Ω ADL5580 ½ RL ½ RL 0.1µF 0.1µF + – –1.8V Figure 33. Differential Input to Differential Output Configuration The differential gain of the ADL5580 is dependent on the source impedance and load, as shown in Figure 34. – AC ADL5580 RL + 0.1µF 0.1µF ½ RS ½ RS 0.1µF 0.1µF Figure 34. Differential Input Loading Circuit Single-Ended Input to Differential Output The ADL5580 can also be configured in a single-ended input to differential output configuration. In this configuration, the gain of the device is reduced due to the application of the signal to only one side of the amplifier. The input and output 0.1 µF capacitors isolate the VCM on input and output pins from the source and balanced load. 0.1µF 0.1µF AC 50Ω R1 R2 ADL5580 ½ RL ½ RL 0.1µF 0.1µF + – Figure 35. Single-Ended Input to Differential Output Configuration The ADL5580 is a high output linearity, fixed gain dc-coupled amplifier for multigigasample ADC interfacing. The open-loop architecture anticipates a 50 Ω differential dc output load. The maximum linear output swing is optimized for 1.4 V p-p differential. LAYOUT Solder the four exposed power supply pads on the underside of the ADL5580 to a low thermal and electrical impedance power plane. These pads are typically soldered to exposed opens in the solder mask on the evaluation board. Notice the use of 4 via holes on each exposed power pad of the ADL5580-EVALZ. Connect these power vias to power layers on the evaluation board to maximize heat dissipation from the device package. For more information on the evaluation board, see the ADL5580-EVALZ product page. Ensure that the decoupling capacitors are located close to the supply voltage pins. |
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