Structural Adhesive Film

AF 30 (5, 10 and 12 mil)

- 2 -

The following product performance data has been obtained in the 3M Laboratory under the conditions specified.

All data reported in this section except as noted, were developed under a cure cycle using 150 psi (1.034 MPa)

bonding pressure applied by a platen press. A 200°F/minute (111°C/minute) bond line temperature rise from 80°F

to 350°F (27°C to 177°C) with 60 ± 1 minutes at 350° ± 2°F (177° ± 1.1°C) was used.

A. Aluminum to Aluminum Overlap Bonds

The following data show typical values obtained with 3M™ Scotch-Weld™ Structural Adhesive Film AF 30

(5 mil) in aluminum overlap bonds. All properties were measured on 1" wide (25.4 mm), 1/2" (12.7 mm) overlap

specimens cut from .063" thick 4" x 7" (1.600 mm thick 101.6 mm x 177.8 mm) bonded panels of 2024-T3 clad

aluminum. Tests were conducted according to MMM-A-132 and primed with 3M™ Scotch-Weld™ Structural

Adhesive Primer EC-1660 (5% solids).

Min. MMM-A-132

Test

Type I

Type

Test

Temperature

Requirement

Average

Failure

Shear Strength

-67 ± 2°F

(-55 ± 1.1°C)

2500 psi

(17.2 MPa)

3400 psi

(23.4 MPa)

Cohesive

75 ± 2°F

(24 ± 1.1°C)

2500 psi

(17.2 MPa)

4000 psi

(27.6 MPa)

Cohesive

180 ± 2°F

(82 ± 1.1°C)

1250 psi

(8.6 MPa)

2350 psi

(16.2 MPa)

Cohesive

250°F

(121°C)

N/A

1400 psi

(9.6 MPa)

Cohesive

300°F

(149°C)

N/A

1100 psi

(7.6 MPa)

Cohesive

B. Aluminum to Aluminum T-Peel Bonds

T-Peel bonds consist of two primed Scotch-Weld EC-1660 (5% solids) 8" x 8" x .020" (203.2 mm x 203.2 mm x

.508 mm) 2024-T3 clad panels together with a 6" x 8" (152.4 mm x 203.2 mm) section of film. This panel is then

cut into 1" x 8" (25.4 mm x 203.2 mm) T-Peel specimens which are peeled at a 90° angle to the bond line with a

jaw separation rate of 20"/minute (508 mm/minute).

Test Temperature

T-Peel

-67°F

(-55°C)

8 lb/inch

(35 N/25 mm)

75°F

(24°C)

35 lb/inch

(156 N/25 mm)

180°F

(82°C)

18 lb/inch

(80 N/25 mm)

Product Performance

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.