Structural Adhesive Film

AF 30 (5, 10 and 12 mil)

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Miscellaneous Test Data – 3M™ Scotch-Weld™ Structural Adhesive Film AF 30 (12 mil)/

3M™ Scotch-Weld™ Structural Adhesive Primer EC-1660

Aluminum to Aluminum T-Peel (In addition to MMM-A-132 requirements)

T-Peel bonds consist of two Scotch-Weld EC-1660 primed 8" x 8" x .020" (203.2 mm x 203.2 mm x .508 mm)

2024-T3 clad panels bonded together with a 6" x 8" (152.4 mm x 203.2 mm) section of film. This panel is then cut

into 1" x 8" (25.4 mm x 203.2 mm) T-Peel specimens which are peeled at a 90° angle to the bond line with a jaw

separation rate of 20"/minute (508 mm/minute).

Platen Press Cure: 350°F, 60 minutes, 50 psi, 10°F/minute (177°C, 60 minutes, 344.5 KPa, 5.6°C/minute

Temperature Rise Rate

Test Temperature

T-Peel

-67°F ± 2°F

(-55°C ± 1.1°C)

9 lb/inch

(40 N/25 mm)

75°F ± 2°F

(24°C ± 1.1°C)

45 lb/inch

(200 N/25 mm)

180°F ± 2°F

(82°C ± 1.1°C)

18 lb/inch

(89 N/25 mm)

250°F ± 2°F

(121°C ± 1.1°C)

11 lb/inch

(49 N/25 mm)

Scotch-Weld AF 30 (12 mil)/Scotch-Weld

Test Temperature

EC-1660 Overlap Shear Strength

250°F

(121°C)

1820 psi

(12.5 MPa)

350°F

(177°C)

1050 psi

(7.2 MPa)

400°F

(204°C)

950 psi

(6.5 MPa)

500°F

(260°C)

500 psi

(3.4 MPa)

Aluminum to Aluminum Overlap Shear (In addition to MMM-A-132 requirements)

The following data shows typical values obtained with Scotch-Weld AF 30 (10 mil) with Scotch-Weld EC-1660 when

tested at temperatures other than those required by MMM-A-132. All properties were measured on 1" (25.4 mm)

wide, 1/2" (12.7 mm) overlap specimens cut from .063" (1.60 mm) thick, 4" x 7" (101.6 mm x 177.8 mm) primed

and bonded panels of 2024-T3 clad aluminum. Tests were conducted per MMM-A-132 Type 1 requirements.

Scotch-Weld AF 30 Modulus of Elasticity @ 75°F (24°C)

19,000 psi (130.9 MPa)

Scotch-Weld AF 30 Tensile Strength @ 75°F (24°C)

3,000 psi (20.7 MPa)

Product Performance

(continued)

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.