Structural Adhesive Film

AF 30 (5, 10 and 12 mil)

- 9 -

Product Application (continued)

4. Remove protective liner.

5. Assemble parts and cure.

Excess primer and equipment may be cleaned up, prior to curing, with ketone* type solvent.

*Note: When using solvents, extinguish all ignition sources and follow manufacturer’s precautions and directions

for use.

Cure Cycle

General Cure Requirements

Time, temperature and pressure determine the final bond properties and may be effected by the type of curing

equipment used for each specific application. In general, the cure properties of 3M™ Scotch-Weld™ Structural

Adhesive Film AF 30 are as follows:

Tack, Flow and Cure Initiation Temperatures

The tack, flow and cure initiation temperatures for Scotch-Weld AF 30 are a time-temperature relationship and

depend upon the rate of heat input. Normally, Scotch-Weld AF 30 has the following properties:

Tack Temperature:

160°F-180°F (71°C-82°C)

Flow Temperature:

180°F-220°F (82°C-104°C)

Cure Initiation Temp.:

220°F-270°F (104°C-132°C)

Cure Pressure

Pressure is required during cure to form the part being bonded and contain any volatiles given off by the adhesive.

Cure pressure may be applied in any matter which will insure uniform constant pressure throughout the bond area.

Pressure must be uniformly applied before the curing reaction begins and maintained until a complete set has been

effected. (i.e., the bond line temperature has reached approximately 300°F (149°C). After this point is reached, the

cure may be completed without pressure if the hot strength of the adhesive is sufficient to maintain contact of the parts

being bonded. The pressure required to contain volatiles is dependent on the rate at which bond line temperature is

brought to the cure temperature. The bond line temperature rise rate for Scotch-Weld AF 30 can be varied from 1°F

to 300°F/minute (0.6°C to 166.7°C/minute). Rise rate (and cure pressure required) will depend on application, cure

temperature, bonding equipment, method of heat application, production limitations and bond properties required.

Figure I depicts typical pressure required for various bond line temperature rise rate in platen presses.

0

Bond Line Temperature Rise Rate

50°F/min

(27.8°C/min)

100°F/min

(55.6°C/min)

150°F/min

(83.8°C/min)

200°F/min

(111.1°C/min)

250°F/min

(138.9°C/min)

300°F/min

(166.7°C/min)

300

250

200

150

100

50

0

2,067

1,723

1,378

1,034

689

344.5

0

Figure I

Cure Pressure vs Bond Line Temperature

Rise in Platen Presses