Structural Adhesive Film

AF 30 (5, 10 and 12 mil)

Miscellaneous Test Data – 3M™ Scotch-Weld™ Structural Adhesive Film AF 30 (10 mil) /

3M™ Scotch-Weld™ Structural Adhesive Primer EC-1660

Scotch-Weld AF 30 (10 mil) on Anodized Aluminum

Overlap Shear (psi) – Cured @ 330°F, 60 minutes, 100 psi, 5-6°F/minute rise (@ 166°C, 60 minutes, 689 KPa,

2.8-3.3°C/minute rise)

Scotch-Weld AF 30 /

Scotch-Weld EC-1660

Test Temperature

(5% solids)

-67°F

(-55°C)

2300 psi

(15.8 MPa)

75°F

(24°C)

4400 psi

(30.3 MPa)

180°F

(82°C)

2600 psi

(17.9 MPa)

250°F

(121°C)

1855 psi

(12.8 MPa)

300°F

(149°C)

1700 psi

(11.7 MPa)

350°F

(177°C)

1430 psi

(9.9 MPa)

- 4 -

Scotch-Weld AF 30 (10 mil) Low Temperature Cure Test Data

Cured 2 hours @ 250°F, 90 psi, 10°F/minute rise (121°C, 620 KPa, 5.6°C/minute rise)

Scotch-Weld AF 30 /

Scotch-Weld EC-1660

Test Temperature

(5% solids)

-67°F

(-55°C)

1870 psi

(12.9 MPa)

75°F

(24°C)

4290 psi

(29.6 MPa)

180°F

(82°C)

1835 psi

(12.6 MPa)

250°F

(121°C)

1245 psi

(8.6 MPa)

300°F

(149°C)

870 psi

(6.0 MPa)

350°F

(177°C)

1025 psi

(7.1 MPa)

Coefficient of Thermal Expansion – Scotch-Weld AF 30 (10 mil) (Per ASTM D 696)

Below 0°F (-18°C)

Above 0°F (-18°C)

Product Performance

(continued)

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.