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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32WL55JC датащи(PDF) 142 Page - STMicroelectronics |
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STM32WL55JC датащи(HTML) 142 Page - STMicroelectronics |
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142 / 145 page  Package information STM32WL55/54xx 142/145 DS13293 Rev 1 6.4 Package thermal characteristics The maximum chip junction temperature (TJ max) must never exceed the values given in Table 25: General operating conditions. The maximum chip-junction temperature, TJ max (in °C), can be calculated using the equation: TJ max = TA max + (PD max x ΘJA) where: • TA max is the maximum ambient temperature in °C. • ΘJA is the package junction-to-ambient thermal resistance, in °C/W. • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max). • PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins: PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH) taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. When the SMPS is used, a portion of the power consumption is dissipated into the external inductor, therefore reducing the device power dissipation. This portion depends mainly on the inductor ESR characteristics. As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the device power consumption. RF characteristics (such as sensitivity, Tx power consumption) are provided up to 85 °C. Table 101. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient UFBGA73 - 5 x 5 mm UFQFPN48 - 7 x 7 mm WLCSP59 20.1 27.4 TBD °C/W ΘJB Thermal resistance junction-board UFBGA73 - 5 x 5 mm UFQFPN48 - 7 x 7 mm WLCSP59 20.2 11.7 TBD ΘJC Thermal resistance junction-top case UFBGA73 - 5 x 5 mm UFQFPN48 - 7 x 7 mm WLCSP59 31.1 8.5 TBD |
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