Front side

Back side

iGMR elements

TLE5041plusC

Package Information

4

Package Information

Pure tin plating (green lead plating) is used with the plastic single small outline package PG-SSO-2-53. The

product complies to restrictions of hazardous substances (RoHS) when marked with the letter G in front or after

the date code. Additionally it shows a data matrix on the back side of the package.

4.1

Package Parameters

Table 11

Package parameters

Parameter

Notes

Thermal Resistance

Lead Frame

material K62 (UNS:C18090)

Lead pull out Force

1) According to Jedec JESD51-7

4.2

Bending for assembly

By following our package handling and assembly recommendation remarks for Sensor-packages the sensor

terminals can be bent without causing incipient cracks influencing the sensor element function. Please contact

your local Infineon application support.

4.3

Package surface to silicon

The distance from the package surface to the surface of the silicon chip d = 0.3 mm ± 0.08 mm.

Figure 20

Distance from package surface to silicon (=sensing element)

Data Sheet

26

V 1.2, 2018-01-18

Symbol Limit Values

Unit

min.

typ. max.

R

thJA

190

K/W

CuSn1CrNiTi

F

PO

10

N