5 Device Comparison Table

DEVICE

(mA)

BW (MHz)

SLEW RATE

(V/µs)

VOLTAGE NOISE (nV/√ Hz)

AMPLIFIER DESCRIPTION

BUF634A

±18

1.5 – 8.5

35 – 210

3750

3.4

Unity-gain, open-loop buffer

BUF634

±18

1.5 – 15

30 – 180

2000

4

Unity-gain, open-loop buffer

LMH6321

±18

11

110

1800

2.8

Unity-gain, open-loop buffer

with adjustable current limit

6 Pin Configuration and Functions

BW

NC

V

IN

V–

NC

V+

V

O

NC

1

2

3

4

8

7

6

5

G = 1

Figure 6-1. D and DDA Packages 8-Pin SOIC, 8-Pin

HSOIC with Thermal Pad Top View

BW

NC

9¤

1

2

3

4

NC

V+

NC

8

7

6

5

Exposed

Thermal

Die Pad

on

Underside

(1)

Figure 6-2. DRB Package (Preview) 8-Pin VSON

with Thermal Pad Top View

Pin Functions

PIN

I/O(2)

DESCRIPTION

NAME

DDA(1)

DRB(1)

D

BW

1

1

1

I

Bandwidth adjust pin. Connect the BW pin to the V– pin for wide-BW

Adjustable Bandwidth section.

NC

2, 5, 8

2, 5, 8

2, 5, 8

—

No internal connection

V–

4

4

4

P

Negative power supply

V+

7

7

7

P

Positive power supply

3

3

3

I

Input

6

6

6

O

Output

Thermal Pad

—

—

Thermal pad. Must be electrically shorted to V–.

(1)

The DRB and DDA packages include a thermal pad on the backside of the device. The thermal pad must be connected to the same

potential as V–. Connect the thermal pad and V– to a heat-spreading plane to achieve low thermal impedance. The thermal pad can

also be unused (not connected to any heat-spreading plane or voltage), thus giving an overall higher thermal impedance.

(2)

I = input, O = output, P = power.

www.ti.com

BUF634A

SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020

Copyright © 2020 Texas Instruments Incorporated

Submit Document Feedback

3

Product Folder Links: BUF634A