Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................3

Pin Functions.................................................................... 3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings........................................ 4

7.2 ESD Ratings............................................................... 4

7.3 Recommended Operating Conditions.........................4

7.4 Thermal Information....................................................4

7.5 Electrical Characteristics: Wide-Bandwidth Mode...... 5

7.6 Electrical Characteristics: Low-Quiescent

Current Mode................................................................ 6

7.7 Typical Characteristics................................................ 7

8 Detailed Description......................................................13

8.1 Overview................................................................... 13

8.2 Functional Block Diagram......................................... 13

8.3 Feature Description...................................................14

8.4 Device Functional Modes..........................................15

9 Application and Implementation.................................. 16

9.1 Application Information............................................. 16

9.2 Typical Application.................................................... 18

10 Power Supply Recommendations..............................20

10.1 Power Dissipation and Thermal Considerations..... 20

11 Layout........................................................................... 21

11.1 Layout Guidelines................................................... 21

11.2 Layout Example...................................................... 23

12 Device and Documentation Support..........................24

12.1 Device Support....................................................... 24

12.2 Documentation Support.......................................... 24

12.3 Receiving Notification of Documentation Updates..24

12.4 Support Resources................................................. 24

12.5 Trademarks.............................................................25

12.6 Electrostatic Discharge Caution..............................25

12.7 Glossary..................................................................25

13 Mechanical, Packaging, and Orderable

Information.................................................................... 25

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (June 2020) to Revision D (September 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added DRB package outline to Mechanical, Packaging, and Orderable Information section.......................... 25

Changes from Revision B (January 2020) to Revision C (June 2020)

Page

• Deleted preview statement for BUF634A HSOIC package................................................................................ 1

• Deleted preview statement for D and DDA packages........................................................................................ 3

Changes from Revision A (May 2019) to Revision B (January 2020)

Page

• Added DRB (VSON) and DDA (HSOIC) packages to document........................................................................1

• Changed Applications section............................................................................................................................ 1

• Changed last paragraph of Description section .................................................................................................1

• Added Power Dissipation and Thermal Considerations section....................................................................... 20

• Added HSOIC Layout Guidelines (DDA Package With a Thermal Pad) section.............................................. 22

• Changed title of BUF634A Layout Example image.......................................................................................... 23

Changes from Revision * (February 2019) to Revision A (May 2019)

Page

• Changed document status from Advance Information to Production Data ........................................................1

BUF634A

SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020

www.ti.com

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