4

TLV752

SBVS383 – DECEMBER 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6.5

V

–0.3

6.5

V

–0.3

2.0

V

–0.3

(2)

V

–40

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

(1)

Minimun derated capacitance of 0.47 μF is required for stability

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

1.5

6.0

V

Output voltage

0.55

5.5

V

Output current

0

1

A

Input capacitor

1

μF

1

220

μF

Enable voltage

0

6.0

V

Enable toggle frequency

10

kHz

Junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TLV752

UNIT

DSQ (WSON)

10 PINS

Junction-to-ambient thermal resistance

74.6

°C/W

Junction-to-case (top) thermal resistance

90.5

°C/W

Junction-to-board thermal resistance

39.7

°C/W

Junction-to-top characterization parameter

3.8

°C/W

Junction-to-board characterization parameter

39.7

°C/W

Junction-to-case (bottom) thermal resistance

17

°C/W