FB1

GND

GND

EN2

OUT1

IN1

OUT2

FB2

IN2

EN1

R3

CFF2

C4

R4

C3

C1

R2

Cff1

R1

C2

GND

22

TLV752

SBVS383 – DECEMBER 2019

www.ti.com

Product Folder Links: TLV752

Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

9 Power Supply Recommendations

Connect a low output impedance power supply directly to the IN pin of the TLV752.

10 Layout

10.1 Layout Guidelines

•

Place input and output capacitors as close to the device as possible.

•

Use copper planes for device connections in order to optimize thermal performance.

•

Place thermal vias around the device to distribute heat.

•

Do not place a thermal via directly beneath the thermal pad of the DSQ package. A via can wick solder or

solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder

joint on the thermal pad.

10.2 Layout Example

Figure 46. Layout Example for the DSQ Package