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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SSD1306Z датащи(PDF) 8 Page - List of Unclassifed Manufacturers |
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SSD1306Z датащи(HTML) 8 Page - List of Unclassifed Manufacturers |
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8 / 65 page  Solomon Systech Apr 2008 P 8/59 Rev 1.1 SSD1306 5 DIE PAD FLOOR PLAN Figure 5-1 : SSD1306Z Die Drawing Pad 1 Die size 6.76mm x 0.86mm Die thickness 300 +/- 25um Min I/O pad pitch 60um Min SEG pad pitch 47um Min COM pad pitch 40um Bump height Nominal 15um Bump size Pad 1, 106, 124, 256 80um x 50um Pad 2-18, 89-105, 107-123, 257-273 25ium x 80um Pad 19-88 40um x 89um Pad 125-255 31um x 59um Pad 274-281 (TR pads) 30um x 50um Alignment mark Position Size + shape (-2973, 0) 75um x 75um + shape (2973, 0) 75um x 75um Circle (2466.665, 7.575) R37.5um, inner 18um SSL Logo (-2862.35, 144.82) - (For details dimension please see p.9 ) Note (1) Diagram showing the Gold bumps face up. (2) Coordinates are referenced to center of the chip. (3) Coordinate units and size of all alignment marks are in um. (4) All alignment keys do not contain gold Pad 1,2,3,…->281 Gold Bumps face up SSD1306 X Y |
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