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SSD1306Z датащи(PDF) 6 Page - List of Unclassifed Manufacturers |
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SSD1306Z датащи(HTML) 6 Page - List of Unclassifed Manufacturers |
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6 / 65 page ![]() Solomon Systech Apr 2008 P 6/59 Rev 1.1 SSD1306 1 GENERAL DESCRIPTION SSD1306 is a single-chip CMOS OLED/PLED driver with controller for organic / polymer light emitting diode dot-matrix graphic display system. It consists of 128 segments and 64commons. This IC is designed for Common Cathode type OLED panel. The SSD1306 embeds with contrast control, display RAM and oscillator, which reduces the number of external components and power consumption. It has 256-step brightness control. Data/Commands are sent from general MCU through the hardware selectable 6800/8000 series compatible Parallel Interface, I2C interface or Serial Peripheral Interface. It is suitable for many compact portable applications, such as mobile phone sub-display, MP3 player and calculator, etc. 2 FEATURES • Resolution: 128 x 64 dot matrix panel • Power supply o VDD = 1.65V to 3.3V for IC logic o VCC = 7V to 15V for Panel driving • For matrix display o OLED driving output voltage, 15V maximum o Segment maximum source current: 100uA o Common maximum sink current: 15mA o 256 step contrast brightness current control • Embedded 128 x 64 bit SRAM display buffer • Pin selectable MCU Interfaces: o 8-bit 6800/8080-series parallel interface o 3 /4 wire Serial Peripheral Interface o I2C Interface • Screen saving continuous scrolling function in both horizontal and vertical direction • RAM write synchronization signal • Programmable Frame Rate and Multiplexing Ratio • Row Re-mapping and Column Re-mapping • On-Chip Oscillator • Chip layout for COG & COF • Wide range of operating temperature: -40 °C to 85°C 3 ORDERING INFORMATION Table 3-1: Ordering Information Ordering Part Number SEG COM Package Form Reference Remark SSD1306Z 128 64 COG 8 o Min SEG pad pitch : 47um o Min COM pad pitch : 40um o Die thickness: 300 +/- 25um SSD1306TR1 104 48 TAB 11, 56 o 35mm film, 4 sprocket hole, Folding TAB o 8-bit 80 / 8-bit 68 / SPI / I2C interface o SEG, COM lead pitch 0.1mm x 0.997 =0.0997mm o Die thickness: 457 +/- 25um |
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