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ADP1071-2ARWZ-R7 датащи(PDF) 6 Page - Analog Devices |
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ADP1071-2ARWZ-R7 датащи(HTML) 6 Page - Analog Devices |
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6 / 27 page ![]() ADP1071-1/ADP1071-2 Data Sheet Rev. B | Page 6 of 27 Parameter Symbol Test Conditions/Comments Min Typ Max Unit SYNC PIN Synchronization Range 100 600 kHz Input Pulse Width 100 ns Number of Cycles Before Synchronization 7 Cycles Input Voltage Low 0.4 V High 3 V Leakage Current 1 µA i COUPLER DELAY COMP Signal Delay Through iCoupler 600 ns OVP PIN THRESHOLDS OVP Pin OV Threshold Overvoltage (OV) threshold for OVP pin 1.3 1.36 1.42 V OVP Pin OV Hysteresis 36 mV OVP Comparator Delay (Includes iCoupler Delay) 320 ns OVP Pin Leakage Current 1 µA OVP Hiccup Time before entering OVP hiccup mode 200 ms Hiccup time trigged by OVP event 200 ms 1 Short-circuit duration is less than 1 μs. Average power must conform to the limit shown in the Absolute Maximum Ratings section. INSULATION AND SAFETY RELATED SPECIFICATIONS Table 2. Parameter Symbol Test Conditions/Comments Min Typ Max Unit WIDE BODY SOIC i COUPLER Rated Dielectric Insulation Voltage 1 minute duration 5 kV Minimum External Air Gap (Clearance) Measured from input terminals to output terminals, shortest distance through air 7.6 mm Minimum External Air Gap (Creepage) Measured from input terminals to output terminals, shortest distance path along body 7.6 mm Minimum Internal Gap (Internal Clearance) Insulation distance through insulation 0.030 mm Tracking Resistance (Comparative Tracking Index) CTI >400 V Isolation Group Material Group (DIN VDE 0110, 1/89, Table 1) II LAND GRID ARRAY (LGA) i COUPLER Rated Dielectric Insulation Voltage 1 minute duration 2.5 kV Minimum External Air Gap (Clearance) Measured from input terminals to output terminals, shortest distance through air 4 mm Minimum External Air Gap (Creepage) Measured from input terminals to output terminals, shortest distance path along body 4 mm Minimum Internal Gap (Internal Clearance) Insulation distance through insulation 0.030 mm Tracking Resistance (Comparative Tracking Index) CTI >400 V Isolation Group Material Group (DIN VDE 0110, 1/89, Table 1) I |
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