ADM3055E/ADM3057E

Data Sheet

Rev. A | Page 24 of 24

OUTLINE DIMENSIONS

20

11

10

1

COPLANARITY

0.10

1.27 BSC

15.54

15.40

15.27

7.59

7.50

7.39

2.64

2.50

2.36

0.89

0.65

0.41

2.44

2.24

0.25

0.10

10.54

10.30

10.06

0.48

0.36

8°

0°

0.33

0.23

0.76

0.25

45°

0.25 BSC

GAGE

PLANE

COMPLIANT TO JEDEC STANDARDS MS-013-AD

TOP VIEW

SIDE VIEW

END VIEW

PIN 1

INDICATOR

SEATING

PLANE

Figure 35. 20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]

Wide Body,

(RI-20-1)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AC

13.00 (0.5118)

12.60 (0.4961)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

20

11

10

1

1.27

(0.0500)

BSC

Figure 36. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body,

(RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADM3055EBRIZ

−40°C to +105°C

20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]

RI-20-1

ADM3055EBRIZ-RL

−40°C to +105°C

20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]

RI-20-1

EVAL-ADM3055EEBZ

ADM3055E Evaluation Board

ADM3057EBRWZ

−40°C to +105°C

20-Lead Standard Small Outline Package [SOIC_W]

RW-20

ADM3057EBRWZ-RL

−40°C to +105°C

20-Lead Standard Small Outline Package [SOIC_W]

RW-20

1

Z = RoHS Compliant Part.

2

Use the EVAL-ADM3055EEBZ evaluation board to evaluate the ADM3057E.

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registered trademarks are the property of their respective owners.

D14972-0-11/18(A)